Apparatus for plasma treatment and method of operating the apparatus

ABSTRACT

Some embodiments of the present disclosure provide a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus includes a chamber, a support and a liner. The chamber is configured for plasma processes and includes a chamber wall. The support is configured to hold a wafer in the chamber. The liner is configured to surround the support and includes a top side and a bottom side. The top side is detachably hung on the chamber wait. The bottom side includes gas passages for plasma particles to pass through the liner.

FIELD

The present disclosure relates to an apparatus for plasma treatment atmethod of operating the apparatus.

BACKGROUND

Plasma is commonly used in a semiconductor manufacturing process TOdeposit layers of materials in the fabrication of semiconductorintegrated circuits and is also used for etching of materials on awafer.

In a deposition or etching operation, plasma is formed in a chamber ofan apparatus. Various conditions in the chamber would affect the qualityof a semiconductor device under fabrication.

SUMMARY

The present disclosure relates to an apparatus for semiconductormanufacturing, and a method of operating an apparatus including a matchnetwork for semiconductor manufacturing.

Some embodiments of the present disclosure provide a semiconductormanufacturing apparatus. The semiconductor manufacturing apparatusincludes a chamber, a support and a liner. The chamber is configured forplasma processes and includes a chamber wall. The support is configuredto hold a wafer in the chamber. The liner is configured to surround thesupport and includes a top side and a bottom side. The top side isdetachably hung on the chamber wall. The bottom side includes gaspassages for plasma particles to pass through the liner.

In an embodiment, the apparatus further includes a pump disposed underthe chamber, and an exhaust tube coupled to the pump. The exhaust tubeis a straight tube.

In another embodiment, the gas passages include a bottom opening at abottom surface of the bottom side.

In yet another embodiment, the bottom opening has a cylindrical shape orcone shape.

In still another embodiment, the liner further includes a lateral sideextending between the top side and the bottom side, and a corner at ajoint of the lateral side and the bottom side.

In yet still another embodiment, the gas passages include a corneropening at the corner.

In a further embodiment, the corner opening is configured to form apassage way tilted with respect to a bottom surface of the bottom, side.

Embodiments of the present disclosure also provide a semiconductormanufacturing apparatus that includes a chamber designed to igniteplasma at a specified pressure. The semiconductor manufacturingapparatus includes a radio frequency (RF) source and a match network.The RF source is configured to generate an RF signal and supplyelectrical power at a first terminal and a second terminal. The matchnetwork is configured to couple the power from the RF source to thechamber to cause plasma ignition in the chamber at a pressure lower thanthe specified pressure. The match network includes a first circuit and asecond circuit. The first circuit is configured to adjust a voltagelevel in response to the RF signal, and includes a first inductivedevice to output an adjusted voltage lead. The first inductive deviceand a capacitive circuit are connected in parallel between the firstterminal and a reference voltage level. The second circuit includes asecond inductive device to provide a predetermined voltage level forigniting plasma. The second inductive device is directly coupled betweenthe second terminal and the reference voltage level.

In an embodiment, a maximum current node at the first inductive deviceand a maximum voltage node at the second inductive device are disposedsymmetrically with respect to a central line of the chamber.

In another embodiment, the predetermined voltage level is higher thanthe adjusted voltage level.

In yet another embodiment, the first inductive device or the secondinductive device includes an antenna in the form of a planar coil orhelical coil.

In still another embodiment, the second inductive device is positionedcloser to a central line of the chamber than the first inductive device.

In yet still another embodiment, the first it device and the secondinductive device are concentrically around the central line.

In an embodiment, the apparatus further includes a shield configured toenclose the semiconductor manufacturing apparatus and the match network.

Some embodiments of the present disclosure provide a method of operatinga semiconductor manufacturing apparatus that includes a match network.The method comprises applying a radio frequency (RF) signal to the matchnetwork, establishing an RF energy by the match network for generating aplasma in response to the RF signal, the match network including a firstnode and an inductive device having a first terminal coupled to thefirst node and a second terminal coupled directly to a reference voltagelevel, and including a second node between the first terminal and thesecond terminal, providing a predetermined voltage at the second node,igniting the plasma under the predetermined voltage level, and adjustingthe match network to achieve an impedance match between the RF signaland the inductive device.

In an embodiment, providing the predetermined voltage at the second nodecomprises increasing a reactance of the match network.

Moreover, the predetermined voltage is higher than 1000 volts.

In another embodiment, providing the predetermined voltage at the secondnode comprises reflecting most of the RF signal from the inductivedevice.

In yet another embodiment, the match network includes another inductivedevice having a terminal coupled to the reference voltage level througha capacitive device.

In still another embodiment, the method further comprises enclosing thesemiconductor manufacturing apparatus by a shield.

Some embodiments of the present disclosure provide a semiconductordevice. The semiconductor device comprises a first region includingdevices arranged at a first density, and a second region, spaced apartfrom the first region, including devices arranged at a second density.The second density is smaller than the first density. A predetermineddepth of the devices in the second region is equal to that of thedevices in the first region. Moreover, an error rate of difference indepth between the devices in the first region and the devices in thesecond region with respect to the predetermined depth ranges frownapproximately 6% to 8%.

In an embodiment, an error rate of average difference in depth betweenthe devices in the first region and the devices in the second regionwith respect to the predetermined depth is 7%.

In another embodiment, a predetermined sidewall angle of the devices inthe first region is equal to that of the devices in the second region,and an error rate of difference in sidewall angle between the devices inthe first region and the devices in the second region with respect tothe predetermined sidewall angle ranges from 4% to 7%.

In still another embodiment, an error rate of average difference insidewall angle between the devices in the first region and the devicesin the second region with respect to the predetermined sidewall angle is6%.

In yet another embodiment, an error rate of difference in sidewall anglebetween a first sidewall and a second sidewall of the devices in thefirst region with respect to the predetermined sidewall angle rangesfrom 4% to 7%.

In yet still another embodiment, an error rate of average difference insidewall angle between a first sidewall and a second sidewall of thedevices in the first region with respect to the predetermined sidewallangle is 5.5%.

The semiconductor manufacturing apparatus and the method of operating anapparatus including a match network for semiconductor manufacturing areable to provide relatively high precision and repeatability andalleviate undesired effects that may deteriorate the quality ofhigh-density integrated circuits in a wafer. These undesired effectsinclude, for example, current leakage, non-uniform etching, patternleading effect or micro-loading effect that may occur due to arelatively high circuit integration density.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1A is a plane view of a semiconductor device, in accordance withsome embodiments of the present disclosure.

FIG. 1B is a cross-sectional view of the semiconductor deviceillustrated in FIG. 1A taken along a line AA′, in accordance with someembodiments of the present disclosure.

FIG. 2A is a plane view of a semiconductor device, in accordance withsome embodiments of the present disclosure.

FIG. 2B is a cross-sectional view of the semiconductor deviceillustrated in FIG. 2A taken along a line BB′, in accordance with someembodiments of the present disclosure.

FIGS. 3 to 5 are cross-sectional views of a semiconductor device inaccordance with some embodiments or the present disclosure.

FIG. 6 is a cross-sectional view of an apparatus in accordance with someembodiments of the present disclosure.

FIG. 7 is a cross-sectional view of a liner, in accordance with someembodiments of the present disclosure.

FIG. 8 is a cross-sectional view of a liner, in accordance with someembodiments of the present disclosure.

FIG. 9 is a block diagram of a match network, in accordance with someembodiments of the present disclosure.

FIG. 10 is a flow diagram of a method for operating an apparatus, inaccordance with some embodiments of the present disclosure.

FIG. 11 is a chart for operation in conjunction with a match network, inaccordance with some embodiments or the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or features relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

With the continuous development in each semiconductor technologygeneration, transistor sizes decrease and the density of semiconductordevices on a wafer increases, resulting in a need for an ever higherdegree of accuracy and repeatability in wafer processing. In a highdensity integrated circuit on a wafer, various effects could alter thequality of the wafer. For example, quality issues such as leakagecurrent, non-uniform etching, pattern loading effect, or micro-loadingeffect could result from high density.

Etching, is a common process in modern approaches for integrated circuit(IC) production. Different etching technologies and methods, includingplasma etching, are available. Of particular importance during etchingprocesses is maintaining uniformity. Uniformity refers to evenness ofetching for a critical dimension such as a desired depth, and evennessof etching across a wafer and from wafer to wafer. At microscopic level,etching rates and profiles depend on feature size and featureseparation. Microscopic uniformity problems can be grouped into severalcategories including pattern-dependent etch effects, generally referredto as a pattern-loading effect. The pattern-loading effect includesmacro loading effect or micro loading effect. More specifically, microloading refers to dependence of etch rate on feature separation foridentically sized features and results from depletion of reactants whenthe wafer has a local, higher-density area.

From a terminology standpoint, critical dimension simply refers to thedimension (e.g., width) of a feature in a direction of interest. Forexample, in a plane view 100 of a semiconductor device illustrated inFIG. 1A, a feature corresponding to a transistor 141 includes a gatestructure 14, a drain region 15, and a source region 17. In someembodiments, the transistor 141 is a p-type metal-oxide-semiconductor(PMOS) field effect transistor, an n-type metal-oxide-semiconductor(NMOS) field effect transistor, or a complementarymetal-oxide-semiconductor (CMOS) transistor. There can be multipletransistors 141 with different lengths or widths.

Referring to FIG. 1A, a circuitry includes a transistor conductivematerials 10, and a semiconductor substrate 1. The transistor 141,having a length L and a width W, includes two gate structures 14 with asource region 17 and drain regions 15, 151 at either side of the sourceregion 17. Length L is from one side of drain region 15 to one side ofdrain re ion 151. Width W is from a surface of the drain region 15 toanother surface of the drain region 15. In some embodiments, the drainregion 15 is separated from the conductive material 10 by a length L142.The drain region 15 can be separated from another conductive material 10by a length L141.

The source region 17 is separated from the other conductive material 10by a length L17. A distance between one conductive material 10 andanother conductive material 10 is L10. Length L141, L142, L10 and L17can be different, depending on circuit design.

Referring to FIG. 1B, a cross-sectional view 110 of the circuitry istaken along a cross-sectional line AA′ passing through the source region17 and conductive materials 10. Cross-sectional view 110 is aligned withthe conductive materials 10, and shows the semiconductor substrate 1,the conductive materials 10, and an intermediate layer 11. Theintermediate layer 11 is disposed between the semiconductor substrate 1and the conductive materials 10. The conductive materials 10 aredisposed over the semiconductor substrate 1. The semiconductor substrate1 includes a recess 20 between the source region 17 and one conductivematerial 10. The recess 20 has a length L17 from a top of source region17 to a top of the one conductive material 10. A bottom of the recess 20has a length L20. In some embodiments, length L20 is smaller than lengthL17.

A recess 21 is disposed between two adjacent conductive materials 10. Adistance between a top of one adjacent conductive material 10 and a topof the other adjacent conductive material 10 is length L10. The recess21 includes a side S in conjunction with a bottom surface B of therecess 21. The bottom surface B includes a length L21. In someembodiments, the side S is tapered such that length L21 is smaller thanlength L10. In some embodiments, conductive material 10 has a height H3,and the intermediate layer 11 has a height H2. In some embodiments,height H3 is substantially equal for each of the conductive materials10. The semiconductor substrate 1 includes a second portion 105 on afirst portion 107. The second portion 105 includes a lateral side, andhas a height H1 from the bottom surface B to a top surface T of thesemiconductor substrate 1, in some embodiments, a different recessincludes a different or similar size. For example, length L20 can begreater than, equal to, or smaller than length L21.

In FIG. 2A, a plane view 200 of a circuitry is illustrated similar toFIG. 1A. In FIG. 2B, a cross-sectional view 210 of the circuitry istaken along a cross-sectional line BB′ passing through on drain region15 and another drain region 15. Cross-sectional view 210 is aligned withthe conductive materials 10. In some embodiments, as a result of microloading effect, different recesses have different depths such thatbottom surfaces of different recesses are higher or lower than eachother.

Length L22 is front one drain region 15 to the other, neighboring drainregion 15. The conductive materials 10 are on top of the drain regions15. The conductive material 10 and the intermediate layer 11 aresubstantially vertically aligned with each other such that length L22 issubstantially constant from the top of conductive material 10 to abottom of intermediate layer 11. A recess 23 is between the drainregions 15. The recess 23 includes a bottom surface B23 having a lengthL23. Moreover, the recess 23 is tapered such that length L23 is smallerthan length L22. Bottom surface B23 is separated from the top surface Tof the semiconductor substrate 1 by a height H4. Bottom surface B23 ishigher than bottom surface B of the recess 21 by a distance D5. HeightH4 is different from height H1 of the second portion 105 by a distanceD5.

One factor of micro loading effect is a process gas pressure inside achamber during plasma treatment. In FIG. 3, a recess 25 is comparedagainst a recess 27. The recess 25 is shallower than the recess 27 as aresult of micro loading effect. The recess 25 includes a smaller openingP25 at a top, while the recess 27 includes a larger opening P27 at atop.

Further, the recess 25 has a length L251 at a top of the smaller openingP25 and a length L25 at a bottom surface of the recess 25. The recess 25is tapered such that length L251 is greater than length L25. Inaddition, the recess 25 has a height H25 from the top of the smalleropening P25 to the bottom surface of the recess 25.

In contrast, the recess 27 has a length L271 at a top of the largeropening P27 and a length L27 at a bottom surface of the recess 27. Also,the recess 27 is tapered such that length L271 is greater than lengthL27. In addition, the recess 27 has a height H27 from the top of thelarger opening P27 to the bottom surface of the recess 27.

By comparison, length L251 is smaller than length L271, and height H25is smaller than height H27 by a length L57. In some embodiments, therecess 25 is more tapered than the recess 27 such that a ratio betweenlength L251 and L25 is greater than a ratio between length L271 andlength 27, given that the smaller opening P25 is smaller than the largeropening P27.

Plasma particles 30 remove portions of semiconductor substrate 1 underthe smaller opening P25 or the larger opening P27 to form the recess 25or 27, respectively. Some plasma particles 30 collide with each otherbefore reaching the openings. Collision may occur above the smalleropening P25 or the larger opening P27. As a result, plasma particles 30come together in an incident path 33 before the collision and spread outin a deflected path 34 after the collision. For incident path 33 with ahorizontal component, a corresponding deflected path 34 can also have ahorizontal component in the opposite direction. For collisions above thesmaller opening P25, plasma particles 30 are snore likely to miss thesmaller opening P25 and hence more likely to land on other regionsoutside of the smaller opening P25. For collisions above the largeropening P27, plasma particles 30 are less likely to miss the largeropening P27 and hence less likely to land on other regions outside ofthe larger opening P27. Consequently, for collisions above the largeropening P27, plasma particles 30 are still likely to enter into thelarger opening P27 and more likely to etch into the semiconductorsubstrate 1 and form the recess 27 through, the larger opening P27.

In forming the recess 25 or recess 27 by using plasma particles 30 in anetch process, plasma particles 30 undergone the collision are morelikely to enter into the larger opening P27 than the smaller openingP25. The larger opening P27 allows more collided plasma particles 30 toetch the recess 27 than the smaller opening P25 can allow. The recess 27is deeper than the recess 25 as more collided plasma particles 30 arecapable of etching the recess 27 than etching the recess 25. Thisnon-uniform etching for different opening sizes is one of a cause ofmicro loading effect.

For plasma treatment with a higher collision rate, the micro loadingeffect becomes more significant such that recesses are less uniform,resulting in a wider variation in the depths of the recesses. Collisionrate of plasma particles 30 is concerned with a mean free path of theplasma particles 30. As the mean free path is longer, collision isfewer. A low collision rate of most plasma particles 30 in a plasmatreatment can mean most of the plasma particles 30 travel verticallydownward to a wafer. Sideway collisions that include those in thehorizontal direction are reduced so that more plasma particles 30 areallowed to etch into the smaller opening P25. Accordingly, increasingthe mean free path of plasma particle 30 reduces the micro loadingeffect. One way of increasing the mean free path of plasma particles 30is reducing process gas pressure.

In FIG. 4, different plasma treatments 331 and 332 to etch semiconductorsubstrate 1 have different results, the micro loading effect is moresignificant in the plasma treatment 331 than the plasma treatment 332.For plasma treatment 331 with a more significant micro loading effect,the depth of recess decreases as the opening of a recess is smaller. Forplasma treatment 332 with a less significant micro loading effect, thedepth of recess remains substantially the same even as the opening of arecess is smaller. Openings of recesses can be, critical dimensions ofrecesses. Critical dimensions can be width W25, W27 or W28 of opening.In the present embodiment, width W28 is greater than width W27, andwidth W27 is greater than width W25.

Recesses 117 under plasma treatment 331 have widths W28, W27 and W25.Moreover, the recesses 117 have depths D4, D7 and D8. Depth D4 isgreater than depth D7, and depth D7 is greater than depth D8.

Recesses 115 under plasma treatment 332 have widths W28, W27, and W25.Moreover, the recesses 115 have a substantially equal depth D4.Regardless of the size of the opening, the recesses 115 have a uniformdepth D4.

In FIG. 5, similar to the case in FIG. 4, micro loading effect may occurwith respect to recesses 117. The recesses 117 are filled with aninsulating material such as dielectric material to serve as an isolationstructure 18. All exemplary recess 117 includes a bending 181 along alateral side S117. A dislocation 19 extends from the bending 181 towardsthe semiconductor substrate 1. The dislocation 19 along the lateral sideS117 is disposed near bending 181. An interface 111 exists between thesemiconductor substrate 1 and the intermediate layer 11.

In FIG. 5, micro loading effect causes different degrees of leakagecurrents.

In some embodiments, for the isolation structure 18 with a shorter depthD8, charge carrier 40 is easier to travel from one second portion 105 toanother second portion 105. For example, in some embodiments, the secondportions 105 are those adjacent to the drain regions 15 in FIG. 2.Charge carrier 40 passes tinder the isolation structure 18 and leaksfrom one drain region to another drain region.

In some embodiments, charge carrier 40 leaks through the interface 111.In still some embodiments, charge carrier 40 leaks through thedislocation 19.

Reducing the process gas pressure increases the mean free path. Further,increasing the mean free path reduces the collision rate of plasmaparticles 30. Moreover, reducing the collision rate reduces microloading effect. Consequently, reducing the micro loading effect reducesleakage current issue in a semiconductor device.

FIG. 6 illustrates a semiconductor manufacturing apparatus 500. Thesemiconductor manufacturing apparatus 500 includes a plasma reactionchamber 59. The plasma reaction chamber 59 includes a liner 57. Theliner 57 serves to confine the plasma. With the liner 57, distributionof an electric field can be changed, the plasma can be essentiallyconfined in a region R inside the liner 57, and plasma density can beincreased. The liner 57 may be used to protect the plasma reactionchamber 59 by preventing the plasma from eroding the other parts, suchas chamber wall 55, of the plasma reaction chamber 59, and thus protectthe plasma reaction chamber 59 from damage. The liner 57 can be cleanedand/or replaced. Moreover, the liner 57 can enhance the uniformity ofprocess gas pressure. The uniformity of the process gas, pressurecorresponds to that of the mean free path of as particles 321.

The region R is above a wafer 70 in the plasma reaction chamber 59.Wafer 70 includes semiconductor substrate 1. Maintaining a uniformprocess gas pressure distribution above semiconductor substrate 1 thatundergoes plasma processing helps producing a uniform critical dimensionin device dies on the semiconductor substrate 1. The pressure in atypical plasma reaction chamber 59 is controlled by introducing processcan and evacuating the plasma reaction chamber 59 at the same time. Without arty restriction on process gas flow in the plasma reaction chamber59, the process gas pressure may form a gradient from a relatively highpressure near an outlet of a gas feed 38 to a relatively low pressurenear an evacuation port 71. The liner 57 partially restricting theprocess gas flow reduces the pressure gradient inside the liner 57.Reducing the pressure gradient increases the uniformity of the gaspressure.

The liner 57 can confine the process gas to a smaller volume and thuslower a feeding rate from the gas feed 38 and a consumption rate of theprocess gas.

The liner 57 includes various features. Specifically, the liner 57includes a lateral portion 83 extending above the wafer 70. To achieve ahigh degree of uniformity of process gas pressure and plasma density,the liner 57 is preferably physically symmetric. The uniformity ofprocess gas pressure and plasma density reduces micro loading effectacross the wafer 70. In some embodiments, the liner 57 is symmetric withrespect to the wafer 70 and free of openings in the lateral portion 83.

FIG. 6 is a cross-sectional diagram of the semiconductor manufacturingapparatus 500 including the plasma reaction chamber 59, liner 57,chamber wall 55, and a dielectric window 39 (e.g., a planar dielectricwindow of uniform thickness). Disposed above the dielectric window 39 isan inductive device 35. The inductive device 35 can be a planarmulti-turn spiral coil, a non-planar multi-turn coil, or an antennahaving another shape, powered by a suitable radio frequency (RF) source201 through suitable RF impedance matching circuit 200 that inductivelycouples RF energy into the plasma reaction chamber 59 to generate plasma(e.g., a high density plasma). The impedance matching circuit 200 canalso be a match network for matching impedances between the RF source201 and the inductive device 35. The impedance matching circuit 200 candistribute power along the coils in the inductive device 35 to establishRF energy for generating plasma. The gas feed 38 is connected to a gassource 37 that supplies process gases into the plasma reaction chamber59.

Directly below the dielectric window 39 is wafer 70 with thesemiconductor substrate 1 under processing. The semiconductor substrate1 is supported on a substrate support 58 incorporating a lower electrodewhich can be RF biased. The lower electrode is RF biased by another RFsource 47. The RF source 47 is different from the RF source 201.Moreover, the RF source 47 is coupled to the lower electrode through animpedance matching circuit 45.

Around the substrate support 58 is the movable, symmetric liner 57. Theliner 57 is detachably hung on the chamber wall 55. The liner 57includes a bottom side 82 having a uniform thickness and provided with aplurality of gas passages. Moreover, the liner 57 is symmetrical withrespect to the plasma reaction chamber 59. Also, the liner 57 is in aform of a circular ring with the center of the circular ring proximatelyat a central line 501 of the plasma reaction chamber 59. The liner 57surrounds the substrate support 58. The center of the substrate support58 is also substantially at the central line 501. The bottom side 82 canalso be a horizontal portion proximately above the substrate support 58.The substrate support 58 holds the wafer 70 and is substantiallyorthogonal to the chamber wall 55. In some embodiments, the bottom side82 is approximately at a same level with the substrate support 58. Thesubstrate support 58, or simply referred to as a support, is disposedproximately in the center of the plasma reaction chamber 59. In someembodiments, the support extends from the chamber wall 55.

The lateral portion 83 is a continuous outer cylindrical wall of auniform thickness, and extends upward axially from an outer perimeter ofthe bottom side 82. Moreover, the lateral portion 83 is substantially inparallel with the chamber wall 55. Also, the lateral portion 83 isspaced apart from the chamber wall 55 by a length L9. The outerperimeter is near a corner 84 at a joint of the lateral side 83 and thebottom side 82. A corner opening 81 is disposed proximately at thecorner 84. The lateral portion 83 extends above the substrate support58. The substrate support 58 is separated from the dielectric window 39by a height H7. The bottom side 82 includes gas passages such as bottomopening 80. The corner 84 also, includes gas passages such as the corneropening 81. Gas passages such as the bottom opening 80 or the corneropening 81 allow gas particles 321 or plasma particles to fall throughthe liner 57. In some embodiments, the substrate support 58 is lowerthan, equal to, or higher than the bottom side 82.

Furthermore, the liner 57 includes a top side 88. The top side 88includes a protruding portion to facilitate hanging the liner 57 on thechamber wall 55. In addition, the top side 88 is separated from thedielectric window 39 by a height H8, and the bottom side 82 is separatedfrom the dielectric window 39 by a height H5.

The plasma reaction chamber 59 also includes a pump 73 disposed at abottom. The pump 73 can be a symmetrical turbo pump alignedsymmetrically with respect to the central line 501. Also, the pump 73cart be a turbo pump to increase gas exhaust rate such that low pressureis developed inside the plasma reaction chamber 59. In some embodiments,the pump 73 can reduce pressure to be lower than around 1 millitorr. Inaddition, the pump 73 is placed symmetrically at the center of theplasma reaction chamber 59 to help lowing pressure uniformly inside theplasma reaction chamber 59. This increases uniformity of gas pressurenear the wafer 70 for plasma treatment.

The pump 73 is coupled to an evacuation port 71 through an exhaust tube72. The exhaust tube 72 is a straight tube free of any turning. Acentral axis of the exhaust tube 72 aligns in parallel with the centralline 501 of the semiconductor manufacturing apparatus 500. In someembodiments, the evacuation port 71, exhaust tube 72, or pump 73 alignssymmetrically with respect to the central line 501.

A shield 79 encloses the semiconductor manufacturing apparatus 500 andthe impedance matching circuits 200 and 45. The shield 79 prevents anexternal electrical or magnetic field from interfering with anelectrical field, magnetic field, or any circuitries inside the shield79. The shield 79 thus helps stabilizing plasma produced by theinductive electrical or magnetic field. Moreover, the shield 79 includesan upper shield 75 and a lower shield 77 to encapsulate thesemiconductor manufacturing apparatus 500 entirely during plasmaprocess.

FIG. 7 is a cross-sectional view of the liner 57. As previouslydiscussed, the liner 57 includes the top side 88, lateral portion 83,and bottom side 82. Referring to FIG. 7, the top side 88 includes a ringshape on top of the lateral portion 83. The corner 84 is in a form of aring at a bottom of the lateral portion 83. Corner openings 81 aredistributed around the ring of the corner 84. The bottom side 82 is aring structure with bottom opening 80 distributed throughout the ringstructure. In the ring structure an aperture 822 is defined to provide aspace for accommodating the substrate support 58 described andillustrated with reference to FIG. 6. The substrate support 58 can fitsymmetrically at the center of aperture 822. In some embodiments, thebottom side 82 is a horizontal side substantially orthogonal to thelateral portion 83. In other embodiments, the bottom side 82 is tiltedfrom the lateral portion 83 by a degree suitable for gas particles 321such as plasma to fall through the gas passages.

In FIG. 7, the top side 88 includes an upper surface T88 and a bottomsurface B88. The bottom surface B88 is detachably mounted on the chamberwall 55 in FIG. 6 such that the bottom surface B88 contacts a topsurface of the chamber wall 55. The top side 88 has a thickness TH88measured vertically from the upper surface T88 to the bottom surfaceB88. In addition, the top side 88 protrudes from the lateral portion 83by a length L88. The top side 88 includes a planar ring surrounding thelateral portion 83.

The lateral portion 83 is a cylindrical structure below the top side 88.Moreover, the lateral portion 83 has a thickness TH83 measuredhorizontally from an inner surface S831 to an outer surface S832. Also,the lateral portion 83 has a height H10 from the upper surface T88 to anupper surface T82 of the bottom side 82. Height H10 is measuredproximately from the upper surface T88 to the corner 84. The cylindricalstructure of the lateral portion 83 includes a diameter D83 of a circlesurrounded by, an inner surface S831.

The bottom side 82 includes the upper surface T82 and a bottom surfaceB82. Thickness TH82 is measured vertically from the upper surface T82 tothe bottom surface B82. The corner 84 is in conjunction between theupper surface T82 and the inner surface S831 of the lateral portion 83.The bottom side 82 has an aperture 822 synthetically aligned at thecenter of the liner 57.

The aperture 822 is in the form of a cylindrical shape with a diameterD82 and a height proximately equal to thickness TH82. Length L82 ismeasured from the corner 84 to the aperture 822 in a horizontaldirection. The bottom side 82 includes bottom openings 80 scatteredaround the aperture 822. The bottom openings 80 may each include acylindrical shape with a diameter D80 and a height proximately equal tothickness TH82. Diameter D82 is substantially greater than diameter D80.The bottom openings 80 are separated from each other by proximatelylength L80. The bottom openings 80 allow the gas particles 321 to passthrough, the liner 57. In some embodiments, the bottom openings 80 mayeach include a cone shape such that a top surface and a bottom surfaceor the bottom opening 80 are different. For example, the bottom surfaceis smaller than the top surface of the bottom opening 80.

The corner opening 81 is disposed at the corner 84. The corner opening81 includes a side surface S84. The side surface S84 includes a heightH81 measured vertically along the inner surface S831 from the corner 84to a topmost point of the corner opening 81. The side surface S84 isnonparallel with the bottom side 82. Moreover, the bottom side 82 is ahorizontal portion. In some embodiments, the side surface S84 isorthogonal to the horizontal portion. The side surface S84 is inparallel with the lateral portion 83. In addition, the side surface S84is coplanar with the inner surface S831. The corner opening 81 includesa bottom surface B84. The bottom surface B84 has as length L81 measuredin parallel along the upper surface 182 from the corner 84 to an inmostpoint closest to the aperture 822. The corner openings 80 are separatedfrom each other by proximately, length L811.

The corner opening 81 includes an upper surface 812 within the lateralportion 83. The upper surface 812 has a thickness TH81 measured from thetopmost point at the inner surface S831 to a lower point at the outersurface S832. In some embodiments, the lower point is located at thebottom surface B82. The corner opening 81 includes a lower surface 814within the bottom side 82. The lower surface 814 is from a topmost pointat the upper surface T82 to a lower point at the bottom surface B82. Insome embodiments, the lower point is located at the outer surface S832.The lower surface 814 tilts away from the bottom surface B82 by a degreeM81. In some embodiments, the upper surface 812 is substantially inparallel with the lower surface 814. In some other embodiments, theupper surface 812 is nonparallel with the lower surface 814 such thatthe upper surface 812 tilts away from the bottom surface B82 by a degreedifferent from the degree M81. The corner opening 81 is configured toform a passage way tilted with respect to the bottom surface B82 of thebottom side 82 to allow gas particles 321 travelling nearly toward thecorner 84 to pass through the liner 57. This prevents gas particles 321from travelling close to the corner 84 and therefor being deflected fromthe inner surface S831 or upper surface 182 near the corner 84.

In FIG. 8, some possible paths for gas particles 321 to travel withinthe liner 570 are illustrated. Liner 570 is similar to the liner 57 inFIG. 7 except that liner 570 is free of corner opening 81 near thecorner 84. The liner 57 includes bottom openings 80 at the bottom side82.

In case 571, gas particles 321 traveling in an incident path 33 towardsthe lateral portion 83. Gas particles 321 bounce off the lateral portion83 and travels in a deflected path 34. The deflected path 34 pointstoward the bottom side 82 and extends through the bottom opening 80.

In case 572, gas particles 321 traveling in the incident path 33 towardsthe lateral portion 83. Gas particles 321 bounce off the lateral portion83 and the bottom side 82 to travel in the deflected path 34. Thedeflected path 34 points toward a region over the aperture 822 where thewafer 70 is placed. In addition, the deflected path 34 includes avertical portion 342 pointing upward, and a horizontal portion 341pointing sideway toward the wafer 70. The deflected path 34 is likely tocause gas particles 321 to collide with other gas particles 322traveling downward toward the wafer 70. Gas particles 322 include nearlyvertical direction pointing toward a region 78. The region 78 covers apredetermined area on the wafer 70 to be etched by gas particles 322.Such collision is similar to the collision in FIG. 3 and can decreasethe mean free path of gas particles 322 within the liner 570. Forexample, without the collision, gas particles 322 can travel a distanceH10 from the top side 88 to the wafer 70. However, the collision canshorten the distance for gas particles 322 to travel. Gas particles 322collide with gas particles 321 at proximately position P4. Position P4is below the top side 88 by a height H11. The distance for gas particles322 to travel is shortened by a difference between height H10 and heightH11. This shortening of the distance traveled by gas particles 322reduces the mean free path of gas particles 322. Horizontal portion 341can deflect gas particles 322 away from region 78. This collisionexacerbates the micro loading effect on the wafer 70.

Case 573 is similar to case 572, except that gas particles 321 first hitthe bottom side 82 then the lateral portion 83. In case 573, gasparticles 321 travel in the incident path 33 towards the bottom side 82.Gas particles 321 bounce off the bottom side 82 and then deflect off thelateral portion 83 near the corner 84. Deflected path 34 points toward aregion over the region 78 on the wafer 70. Deflected path 34 includes avertical portion 342 pointing upward and a horizontal portion 341pointing toward the wafer 70. Deflected path 34 is likely to causecollision with gas particles traveling toward the wafer 70 in a nearlyvertical downward direction.

Case 574 is similar to case 573 or case 572, except that gas particles321 hit closer to the corner 84 than in case 573 or case 572. Gasparticles 321 hitting proximate to the corner 84 deflect off the bottomside 82 and/or the lateral portion 83 near the corner 84. By deflectingoff the bottom side 82, gas particles 321 acquire the vertical portion342 traveling upward toward the top side 88. By deflecting off thelateral portion 83, gas particles 321 acquire horizontal portion 341traveling sideway toward the lateral portion 83. Deflected path 34 cancause collision with other gas particles and alter their direction andshorten their mean free paths.

The corner opening 81 in FIG. 7 eliminates deflection of gas particles321 near the corner 84 by allowing gas particles 321 to pass through thecorner 84. Most of the deflection with the bottom side 82 and/or lateralportion 83 that causes collision in the liner 57 can be eliminated. Inparticular, collision with the lateral portion 83 causes gas particlesto travel sideway such that collided gas particles easily miss apredetermined etching area such as the region 78, especially when a sizeof the region 78 is relatively small. A collision that causes thehorizontal portion 341 is a sideway collision. Gas particles, such asplasma particles 30 in FIG. 3, experience the sideway collision and missthe smaller opening P25 more likely than miss the larger opening P27 inFIG. 3. For smaller opening P25, a small amount of horizontal portion341 can knock gas particles away from the smaller opening P25. Forlarger opening P27, a small amount of horizontal portion 341 can alter adirection of a gas particle but still allow the gas particles to fallwithin the larger opening P27. Sideway collision can cause micro loadingeffect by knocking more gas particles away from smaller opening P25 thanfrom larger opening P27.

Another way to increase the mean free path of as particles is bylowering a pressure of the gas particles. However, as the pressure ofthe gas particles decreases, a voltage for igniting plasma from the gasparticles increases. To increase the voltage, second inductive device255 is connected directly to ground as shown in FIG. 9.

FIG. 9 is a schematic diagram showing a match network 211. The matchnetwork 211 changes impedance in response to radio frequency (RF) powerby an RF source 201. The match network 211 includes a first circuit 220and a second circuit 212. Moreover, the match network 211 can be similarto a combination of the match circuit 200 and the inductive device 35 inFIG. 6.

First circuit 220 includes a circuit 222, a first inductive device 250and a capacitive circuit 232. The First circuit 220 adjusts a voltagelevel at node 251 in response to a radio frequency (RF) signal from RFsource 201. The first inductive device 250 is configured to output anadjusted voltage level. Node 251 is a first terminal of the firstinductive device 250. Node 251 is located between the circuit 222 andthe first inductive device 250. First inductive device 250 includes asecond terminal at node 252. Node 252 is located between the firstinductive device 250 and the capacitive circuit 232. Node 252 is coupledto a reference voltage level 270 through the capacitive circuit 232. Thereference voltage level 270 can be a zero ground voltage. Firstinductive device 250 includes an inductance. First inductive device 250is disposed similarly as inductive device 35 in FIG. 6. First inductivedevice 250 or second inductive device 255 includes a coil configurationto provide the RF energy such as electric field or magnetic fieldproximate to the region R in FIG. 6. First inductive device 250 or thesecond inductive device 255 can be an antenna with a shape of a planarcoil or helical coil. Capacitive circuit 232 includes reactive elementssuch as a capacitor or an inductor. Capacitive circuit 232 includes afirst capacitance substantially larger than a second capacitance betweennode 258 and the reference voltage level 270 in the second circuit 212.A current or a voltage varies at node 251 or node 252 depending on areactance of the first inductive device 250 and a reactance of thecapacitive circuit 232. In some embodiments, the circuit 222 is similarto the match circuit 200 in FIG. 6.

Second circuit 212 includes the circuit 222 and a second inductivedevice 255. The second circuit 212 provides a predetermined voltagelevel at point 551. The predetermined voltage level of the secondcircuit 212 is greater than the adjusted voltage level of the firstcircuit 220 during, an ignition of plasma. Second circuit 212 provides apredetermined voltage level to ignite the plasma. Plasma ignition may beconducted by using different gases. Each of the gases has a differentminimum ignition voltage. For example, nitrogen (N₂) has an ignitionvoltage of approximately 250V, and oxygen (O₂) of approximately 440V.However, at a relatively low pressure region in the order of millitorr,due to low collision rate, plasma ignition is difficult. As a result,the hot spot voltage is higher, for example, about 800V to 1000V. Insome embodiments, the predetermined voltage is proximately higher than1000 volts.

The second inductive device 255 includes a first terminal, node 259,coupled to the second terminal, node 257, of the circuit 222, andincludes a second terminal, node 258, coupled directly to the referencevoltage level 270.

The RF source 201 can be a power supply supplying electrical powerthrough circuit 222 to the first inductive device 250 or secondinductive device 255. In some embodiments, the first inductive device250 or second inductive device 255 is wound around an axis which is inparallel to the central line 501, i.e., perpendicular to a plane of thedielectric window 39 in FIG. 6. In some embodiments, an RF currentthrough the first inductive device 250 or second inductive device 255produces an RF electromagnetic field in the region R of the plasmareaction chamber 59 just below the dielectric window 39 so as to coupleRF power to plasma and thereby enhance a density of the plasma in FIG.6.

The circuit 222 may include a plurality of reactive elements. Inductors,capacitors, or a combination of inductors and capacitors can be used asthe plurality of reactive elements. The capacitors or inductors can beconnected to the power supply, in parallel or in series. The pluralityof reactive elements can include fixed or variable capacitance orinductance. The number of reactive elements is variable in order toadjust a phase or magnitude of an applied voltage and current.

After the phase and magnitude of the applied voltage are changed by thereactive elements in the circuit 222, a distributed voltage is appliedto the first inductive device 250 or second inductive device 255. Insome embodiments, the circuit 222 can include capacitors connected tonode 251 or node 257 in series or in parallel. Circuit 222 can adjustthe distributed voltage or current in the first inductive device 250and/or second inductive device 255 in response to an RF signal from theRF source 201. Circuit 222 can change the voltage or current differencesbetween node 251 and node 252, between node 259 and 258, or between node25 and node 259.

For first, inductive device 250 or second inductive device 255 wound ina shape of a spiral coil, a circular current pattern provided by suchspiral coils creates toroidal-shaped plasmas which can in turn causeradial non-uniformity in etch rate at the wafer 70 in FIG. 6. In otherwords, E-field inductively generated by a planar coil antenna isgenerally azimuthal to make azimuthal plasma.

Some lengths of coupling lines used to construes the planar coilantenna, such as the first inductive device 250 or second inductivedevice 255 have certain electrical lengths at a radio frequency at whichthey typically operate. In some embodiments, Voltage and current wavestraveling forward from a first terminal such as node 251 to a secondterminal such as node 252 will be partially or totally reflected back atthe second terminal. A superposition of a forward and reflected wavesresults in a standing wave on the coil (i.e., the voltage and currentvary periodically along a length of the coil).

For the coil such as second inductive device 255 grounded at node 258,the current at node 258 is at a maximum value, and the voltage at node258 is zero. Proceeding along the coil toward node 259, the voltageincreases and the current decreases until, at point 551 which is 90degrees of electrical length, the voltage is at maxi ruin and thecurrent is at a minimum. In some embodiments, the voltage can be maximumnear other locations such as node 259. Point 551 can be located anywherebetween node 259 and node 258 according to the electrical length ofsecond inductive device 255. Point 551 can be referred to as a hot spotwhere a maximum voltage is located along second inductive device 255. Bycoupling node 258 directly to ground, the maximum voltage is higher thanthe distributed voltages in first inductive device 250.

For the coil such as first inductive device 250, in some embodiments,node 252 is coupled with a capacitance in the capacitive circuit 232such that the current in the coil is similar at both node 251 and node252 and increases to a maximum near the middle of the coil. The voltageis highest at both terminals such as node 251 and node 252 and decreasesto a minimum near the middle of the coil. In some embodiments, maximumvoltages at both node 251 and node 252 are smaller than the maximumvoltage at point 551 in the second inductive device 255.

A voltage varies in a direction along the length of the coil. Forexample, in second inductive device 255, point 551 is at the maximumvoltage. On either side of point 551 the voltage drops off. Therefore,energy coupling to ignite plasma is higher beneath point 551 andcorresponding plasma is more likely to form under point 551 than beneathnode 259, node 258, or first inductive device 250. A relatively highvoltage can be achieved by shorting second inductive device 255 directlyto ground, such that discharge can be easily struck at a low pressureregime, typically less than 1 millitorr.

A system for improving an inductive coupling uniformity within anantenna system includes controlling a position and current distributionof the antenna to improve plasma uniformity.

According to some exemplary embodiments, two or more spiral coils arepositioned on dielectric window 39 in FIG. 6. Each coil is either planaror a combination of both a planar coil and a vertically stacked helicalcoil. The capacitive circuit 232 determines where the current or voltageis at a maximum or a minimum in the first inductive device 250, whilethe reactive elements in the circuit 222 can change an overall impedanceof each circuit such as the first circuit 220 or second circuit 212, andtherefore, a ratio of current magnitudes in these multiple coils can beadjusted. By adjusting a magnitude of the current and a location of amaximum current in each coil, plasma density, and therefore, plasmauniformity, can be controlled.

In some embodiments, the electrical lengths of the coils can affectuniformity of voltage or current along the coils. For example, in someembodiments, the second inductive device 255 includes a shorter lengththan that of the first inductive device 250. In some embodiments, thevoltage or current in the second inductive device 255 can be moreuniform than in the first inductive device 250.

In some embodiments, the first inductive device 250 and the secondinductive device 255 are two multiple-turn or single-turn coils. Thesecond inductive device 255 is positioned closer to the central line501, while the first inductive device 250 is positioned further awayfrom the central line 501 and closer to an outer boundary 351 in FIG. 6.In some embodiments, the first inductive device 250 and the secondinductive device 255 are concentrically around the central line 501. Inaddition, the first inductive device 250 and second inductive device 255are symmetric with respect to the central line 501. In FIG. 9, an RFsignal is simultaneously fed to the first inductive device 250 andsecond inductive device 255 through node 251 and node 259, respectively.Opposite ends of the first inductive device 250 and the second inductivedevice 255 are terminated to the capacitive circuit 232 and thereference voltage level 270, respectively. The two coils effectivelygenerate more gradual toroidal-shaped plasma. In some embodiments, thecurrents flow in the first inductive device 250 and the second inductivedevice 255 are in a same direction with respect, to the central line 501in FIG. 6. Power in electromagnetic fields coupling to the plasma fromthe coils spread out over region R and produce a single flattenedtoroidal-shaped plasma. For unbalanced currents between the firstinductive device 250 and the second inductive device 255, a toroidalfield of electromagnetic field can be stronger near the central line 501or near the outer boundary 351. For example, by increasing current inthe first inductive device 250, plasma density can increase near theouter boundary 351, or by increasing current in the second inductivedevice 255, plasma density can increase near the central line 501.

Reactive elements in the circuit 222 are provided for each coil so as toobtain a more symmetrical current distribution along the coils. Forexample, one can adjust the reactive elements so that a current maximum(as well as a purely resistive impedance point) occurs at a maximumpoint 550 in the first inductive device 250. Maximum point 550 can be ata half of the electrical length from node 251 or node 252. The currentis highest in the maximum point 550 and is reduced away from the maximumpoint 550 in a normally sinusoidal fashion on either side. One canadjust capacitance of the capacitive circuit 232 to achieve a maximumcurrent near the maximum point 550 of the first inductive device 250. Asa result, power coupling to plasma is higher beneath the maximum point550 and a corresponding plasma density is higher. In some embodiments,the maximum current achieves in the second inductive device 255 can benear node 258. A location of maximum point 550 in first inductive device250 can be adjusted such that maximum point 550 and the hot spot aresymmetrically located with respect to the central line 501 in FIG. 6.Maximum point 550 can be opposite of point 551 along a same radial axis.Therefore, a higher power coupling of the second inductive device 255 atnode 258 offsets a high density plasma effect by maximum point 550 ofthe first inductive device 250, resulting in a more azimuthally uniformplasma. As an alternative to adjusting the reactance of the circuit 222or capacitive circuit 232, an azimuthal position of the first inductivedevice 250 can be physically rotated relative to that of the secondinductive device 255, so that current maxima in the first inductivedevice 250 and the second is device 255 are located opposite of eachother on either side of the central line 501 in FIG. 6.

The match network 211 can achieve impedance match between the RF source201 and the first inductive device 250 and/or between the RF source 201and the second inductive device 255.

Match network 211 transforms an impedance of the first inductive device250 and/or second inductive device 255 to match a characteristicresistive output impedance of a power supply such as the RF source 201.In some embodiments, the characteristic impedance is around 50 ohm. Thereactive elements in the circuit 222 are adjusted to minimize areflected power at an output 202 of the RF source 201. Match network 211is adjusted for minimum reflected power.

In FIG. 10, a method 400 of operating semiconductor manufacturingapparatus 500 is illustrated. FIG. 10 illustrates an operational flowfor operating semiconductor manufacturing apparatus 500 in FIG. 6.Operation 410 applies a radio frequency (RF) signal to the match network211 in FIG. 9. Some exemplary embodiments for operation 410 areillustrated in operation 410 in FIG. 11. Operation 415 provides apredetermined voltage at the hot spot such as point 551 in FIG. 9. Someexemplary embodiments for operation 415 are illustrated in operation 415in FIG. 11. Operation 420 ignites the plasma under the predeterminedvoltage level. Some exemplary embodiments for operation 420 areillustrated in operation 420 in FIG. 11. Operation 425 adjusts the matchnetwork 211 to achieve an impedance match between the RF signal and theinductive device 250 or 255 in FIG. 9. Some exemplary embodiments foroperation 425 are illustrated in operation 425 in FIG. 11. Operation 430achieves the impedance match. Some exemplary embodiments for operation430 are illustrated in operation 430 in FIG. 11.

In FIG. 11, a chart 401 for generating plasma includes operations 410,415, 420, 425, and 430. Each operation represents a stage in a processof generating plasma. Plasma generation is useful in a variety ofsemiconductor fabrication processes, for example plasma enhanced etchingand deposition. Plasmas are produced from a low pressure gas by electricfield ionization and generation of free electrons which ionizeindividual gas molecules through a transfer of kinetic energy viaindividual electron-gas molecule collisions. The electrons are commonlyaccelerated in electric field, typically a radio frequency electricfield.

In some embodiments, during plasma generation, the semiconductormanufacturing apparatus 500 is encapsulated by a shield 79 to preventelectromagnetic interference from outside. The plasma is generated inthe plasma reaction chamber 59 at a pressure below a predeterminedpressure. In some embodiments, the predetermined pressure is set to bearound 2 millitorrs to reduce the micro loading effect during a plasmatreatment.

In operation 410, a radio frequency source such as the RE source 201 isused to provide an oscillating current or voltage to en antenna systemsuch as the first inductive device 250 or the second inductive device255, typically via the match network 211 in FIG. 9. The oscillatingcurrent resonates through an antenna system, inducing an azimuthalelectric field within the plasma reaction chamber 59 in FIG. 6. At thesame time, a process gas is introduced into the plasma reaction chamber59 via a gas feed 38, and the induced electric field ionizes the processgas to produce plasma within the plasma reaction chamber 59 in FIG. 6.The plasma then impinges upon the wafer 70, which is held in place byway of electrostatic chuck such as the substrate support 58, andprocesses (e.g., etching) the wafer 70 as desired.

In FIG. 11, during operation 410, impedance in match network 211 in FIG.9 is mostly reactance with almost no resistance. This occurs when the RFsource 201 starts to supply power to the match network 211. An RF signalestablishes RF energy by the match network 211 for generating plasma inresponse to the RF signal. The RF energy is coupled from RF signalthrough the match network 211. The match network 211 in FIG. 9 includefirst node 257 and the second inductive device 255 having a firstterminal such as node 259 coupled to the first node 257. Second terminalsuch as node 258 is coupled directly to the reference voltage level 270.Second node such as point 551 is a hot spot between the first terminalsuch as node 259 and the second terminal such as node 258. In someembodiments, the match network 211 includes another inductive devicesuch as the first inductive device 250 having a terminal such as node252 coupled to the reference voltage level 270 through a capacitivedevice in the capacitive circuit 232.

During operation 410, in some embodiments, the reactance is capacitiveas shown in chart 401 in FIG. 11. The impedance lies at a point on aunity circumference circle indicating a short circuit between the RFsource 201 and a load such as the first inductive device 250 and/orsecond inductive device 255.

During operation 410, the voltage is mostly reflected from the load. Forexample, the voltage transmitting toward the first inductive device 250is reflected back toward the RF source 201. A ratio between themagnitude of the reflected voltage and the magnitude of the incidentvoltage is a reflection coefficient. The magnitude of the reflectioncoefficient is unity during operation 410, and nearly all power from theRF source 201 is reflected. Almost no plasma is formed during operation410.

During operation 415, the impedance in the match network 211 in FIG. 9is still mostly reactance with low resistance. In some embodiments,reactive elements in the circuit 222 are adjusted such that thecapacitive reactance increases in the match network 211. Increasing thereactance to increase the voltage in the first inductive device 250 orsecond inductive device 255. During operation 415, the impedance stilllies at a point on the unity circumference circle indicating a shortcircuit between the RF source 201 and the load. Nearly all power fromthe RF source 201 is reflected.

During operation 415, the voltage or current at point 551 starts toincrease to reach a maximum voltage such as the predetermined voltage inthe second inductive device 255. RF energy in the plasma reactionchamber 59 also increases to reach a maximum energy for plasma ignition.In some embodiments, depending on a variation of capacitance in thecircuit 222 or capacitive circuit 232, the voltage at node 251 and node252 are also increasing to reach another maximum voltage in the firstinductive device 250. In some embodiments, the maximum voltage in thesecond inductive device 255 is higher than that of the first inductivedevice 250. Still almost no plasma is formed under point 551 duringoperation 415.

During operation 415, in some embodiments, the current at point 551decreases to reach a minimum in the second inductive device 255. Thecurrent increases from point 551 toward either terminal such as node 259or node 258.

During operation 420, the impedance in the match network 211 in FIG. 9is, still mostly reactance with low resistance. The capacitive reactancereaches maximum at around 0.5 of the normalized it in chart 401.

During operation 420, in some embodiments, the voltage at point 551reaches the maximum voltage in the second inductive device 255. In someembodiments, the maximum voltage is a predetermined voltage provided atthe second node such as point 551. The predetermined voltage isproximately higher than 1000 volts. In some embodiments, the voltage atnode 251 and node 252 are also reaching a maximum voltage in the firstinductive device 250. At the maximum voltage, plasma ignition cuts inthe region R, proximately beneath point 551. The plasma is ignited underthe predetermined voltage level. In some embodiments, plasma ignitionalso occurs proximately beneath points such as node 251 or node 252where the maximum voltage in First inductive device 250 occurs.

During operation 420, the current at point 551 increases from point 551toward either side of point 551 and reaches a current maximum at eitherside close to node 259 or node 258. The density of plasma beneath thesecond inductive device 255 also increases from regions nearly underpoint 551 toward other regions under node 259 and/or node 258. In someembodiments, the current in first inductive device 250 also reaches thecurrent maximum at some predetermined locations such that the density ofplasma are substantially uniform with a location of each current maximumsymmetrically arranged with respect to the central line 501 in FIG. 6.

During operation 425, the impedance in the match network 211 in FIG. 9is adjusted such that both reactance and resistance are altered. Thecapacitive reactance changes automatically from a maximum at around 0.5to an impedance matching point in chart 401. The impedance can bechanged during operation 425 under various, ways. The impedanceeventually reaches a center of chart 401 where the impedances of thecoils such as the first inductive device 250 and/or second inductivedevice 255 equals to the characteristic impedance of the RF source. Fromoperation 420 to operation 430, the resistance changes from around 0 toaround 1 in a normalized impedance in chart 401. The reactance changesfrom around 0.5 to 0 in the normalized impedance.

During operation 425, in some embodiments, the voltage in the firstinductive device 250 or second inductive device 253 changes according toan adjustment of the impedance in the match network 211. After theignition of plasma, the voltage can be decrease to a lower voltage ineither the inductive device 255 or 250. In some embodiments, the voltageat point 551 can be decreased to below the maximum voltage for theplasma ignition.

In operation 425, current in the first inductive device 250 or secondinductive device 255 also changes according to the adjustment of theimpedance in the match network 211. In some embodiments, operation 425is to achieve uniformity of the current such that a difference of themagnitude of the current along the first inductive device 250 or secondinductive device 255 is reduced. The magnitude of the current in thefirst inductive device 250 and second inductive device 255 are to besymmetrical with respect to the central line 501 in FIG. 6. The densityof plasma formed corresponds to the magnitude of the current. Most ofthe plasma is formed during operation 425.

During operation 430, the impedance in the match network 211 in FIG. 9are matched with an impedance of the RF source 201. The reactance of theimpedance reaches around 0 in the normalized impedance in chart 401. Theresistance reaches around 1 in the normalized impedance.

During operation 430, the voltage is mostly transmitted to the load. Forexample, the voltage transmitting toward node 251 is transmitted towardthe first inductive device 250. The magnitude of the reflectioncoefficient is nearly 0 during operation 430, nearly all power from theRF source 201 is transmitted. In some embodiments, after the voltagedecreases to a certain level, the voltage can stay for a certain periodduring the operation of the plasma treatment such as etching. Most ofthe plasma is form during operation 430.

In operation 430, current in the first inductive device 250 or secondinductive device 255 are maintained such that the density of plasma iskept to be substantially uniform for a certain period during theoperation of the plasma treatment.

The match network 211 and the method of operating a semiconductormanufacturing apparatus in accordance with the embodiments of thepresent disclosure enable the plasma reaction chamber 59, which wouldotherwise ignite plasma at a specified pressure, to ignite plasma at apressure lower than the specified pressure, using the same process gas,so as to alleviate micro loading effect during plasma treatment. Thespecified pressure refers to a pressure at which a general plasmareaction chamber like the plasma reaction chamber 59, in the absence ofthe impedance match network 211 according to the present disclosure, isrequired to ignite plasma. For example, the specified, pressure is 3millitorrs. In some embodiments, the plasma reaction chamber 59 inconjunction with the match network 211 enables plasma ignition at arelatively low pressure, for example, 2 millitorrs. The presentdisclosure, however, is not limited to any specific value or range ofpressure, for example, the specified pressure, and hence the lowerpressure for plasma ignition, may be different as the process gas isdifferent.

Table 1 below shows experiment data of semiconductor devices at a firstregion (R1) and a second region (R2) in semiconductor wafersmanufactured in accordance with the present disclosure. The first regionis spaced apart from the second region. In addition, the density ofsemiconductor devices at the first region is larger than that at thesecond region. Accordingly, the first region is a dense region, whilethe second region is a sparse region. In Table 1, depths D1 and D2 referto a distance between a bottom surface of a recess (which issubsequently filled by insulation material and therefore becomes anisolation structure) and a top surface of a semiconductor substrate. Insome embodiments, a predetermined value for the depths D1 and D2 is 2700angstroms (Å). Further, first sidewall angle (SWA1) refers to an anglebetween an upper sidewall (disposed between the bending 181 and theintermediate layer 11 as shown in, for example, FIG. 5) of a recess anda bottom surface of the semiconductor substrate. Moreover, secondsidewall angle (SWA2) refers to an angle between a lower sidewall(disposed between the bending 181 and the bottom surface of a recessassociated with the bending 181 as shown in, for example, FIG. 5) of therecess and the bottom surface of the semiconductor substrate. Ideally,the first and second sidewall angles SWA1, SWA2 are substantially 90degrees. In addition, since no significant bending 181 may appear at thesparse region R2, sidewall angle SWA is deemed as an angle between theupper sidewall of a recess and a bottom surface of the semiconductorsubstrate.

TABLE 1 R1 first second R2 sidewall sidewall sidewall depth angle angledepth angle wafer (D1) (SWA1) (SWA2) (D2) (SWA) Nos. (Å) (degrees)(degrees) (Å) (degrees) 1 2617 88.3 83.6 2792 83.2 2 2678 89.3 85.6 283683.6 3 2461 88.4 83.7 2614 85.4 4 2415 89.9 83.1 2583 84.1 5 2525 90.984.7 2695 85.4 6 2412 90.6 83.1 2546 85 7 2941 88.6 86.6 3133 82.2 82661 89 83.6 2949 85.1 9 2675 89.7 86.1 2872 84.1 10 2666 89.7 83.7 288283.5 11 2735 90.1 85 2967 83.6 12 2545 87.4 83.5 2730 83.2 13 2337 88 832489 84.1 14 2441 89.2 83.6 2632 83 15 2735 89.4 85 2963 83.2 16 248589.2 83.3 2714 83.3 17 2559 88.3 84.6 2747 83.2 18 2702 89 84.2 289084.3 average 2588.33 89.17 84.22 2779.67 83.86

It can be round from Table 1 that, due to micro loading effect, thedepth D1 at the dense region R1 is smaller than the depth D2 at thesparse region R2, and the first sidewall angle SWA1 at the dense regionR1 is greater than the sidewall angle SWA at the sparse region R2.

Table 2 below shows an analysis based on the experiment data in Table 1.

TABLE 2 difference difference of sidewall difference between of depthsangles between first and second between R1 and R2 sidewall angles inwafer R1 and R2 (SWA1 − SWA) R1 (SWA1 − SWA2) Nos. (D2 − D1) (Å)(degrees) (degrees) 1 175 5.1 4.7 2 158 5.7 3.7 3 103 3 4.7 4 168 5.86.8 5 170 5.5 6.2 6 134 5.6 7.5 7 192 6.4 2 8 288 3.9 5.4 9 197 5.6 3.610 216 6.2 6 11 232 6.5 5.1 12 185 4.2 3.9 13 152 3.9 5 14 191 6.2 5.615 228 6.2 4.4 16 229 5.9 5.9 17 188 5.1 3.7 18 188 4.7 4.8 average191.33 5.31 4.94

It can be fund from Table 2 that, due to micro loading effect, thesmallest difference between the depth D1 at the dense region R1 and thedepth D2 at the sparse region R2 is approximately 134 Å (wafer No. 6),while the largest difference is approximately 288 Å (wafer No. 8). Giventhe predetermined depth of 2700 Å, the error rates of the smallestdifference and the largest difference are 4.96% and 10.67%,respectively. In addition, the average difference between the depth D1at the dense region R1 and the depth D2 at the sparse region R2 isapproximately 191.33 Å, which means an error rate of 7.1% with respectto the predetermined depth of 2700 Å. In some embodiments, the errorrate of the difference between the depth D1 at the dense region R1 andthe depth D2 at the sparse region R2, with respect to the predetermineddepth of 2700 Å, ranges from approximately 5% to 11%, and preferably 6%to 8%, while the average error rate is approximately 7%. Effectively,the difference of depths between a dense region and a sparse region dueto micro loading effect is significantly reduced.

Also, due to micro loading effect, the smallest difference between thefirst sidewall angle SWA1 at the dense region R1 and the sidewall angleSWA at the sparse region R2 is approximately 3 degrees (wafer No. 3),while the largest difference is approximately 6.5 degrees (wafer No.11). Given the predetermined angle of 90 degrees, the error rates of thesmallest difference and the largest difference are 3.33% and 7.22%,respectively. In addition, the average difference between the firstsidewall angle SWA1 at the dense region and the sidewall angle SWA atthe sparse region R2 is approximately 5.31 degrees, which means an errorrate of 5.9% with respect to the predetermined angle of 90 degrees. Insome embodiments, the error rate of the difference between the firstsidewall angle SWA1 at the dense region R1 and the sidewall angle SWA atthe sparse region R2, with respect to the predetermined angle of 90degrees, ranges from approximately 3% to 7.5%, and preferably 4% to 7%,while the average error rate is approximately 6%. Effectively, thedifference of sidewall angles between a dense region and a sparse regiondue to micro loading effect is significantly reduced.

Due to different aspect ratios, the smallest difference between thefirst and second sideman angles SWA1, SWA2 at the dense region R1 isapproximately 2 degrees (wafer No. 7), while the largest difference isapproximately 7.5 degrees (wafer No. 6). Given the predetermined angleof 90 degrees, the error rates of the smallest difference and thelargest difference are 2.22% and 8.33%, respectively. In addition, theaverage difference between the first and second sidewall angles SWA1,SWA2 at the dense region R1 is approximately 4.94 degrees, which meansan error rate of 5.49% with respect to the predetermined angle of 90degrees. In some embodiments, the error rate of the difference betweenthe first and second sidewall angles SWA1, SWA2 at the dense region R1,with respect to the predetermined angle of 90 degrees, ranges fromapproximately 2% to 8.5%, and preferably 4% to 7%, while the averageerror arts is approximately 5.5%. Effectively, the difference ofsidewall angles at a dense region due to different aspect ratios issignificantly reduced.

The scope of the present disclosure is not intended to be limited to theparticular embodiments of the process, machine, manufacture andcomposition of matter, means, methods and steps described in thespecification. As one of ordinary in the art will readily appreciatefrom the present disclosure, processes, machines, manufacture,compositions of matter, means, methods, or steps, presently existing orlater to be developed, that perform substantially the same function orachieve substantially the same result as the corresponding embodimentsdescribed herein may be utilized according to the present disclosure.Accordingly, the appended claims are intended to include within theirscope such processes, machines, manufacture and compositions of matter,means, methods, or steps.

What is claimed is:
 1. A semiconductor manufacturing apparatus,comprising: a chamber, configured for plasma processes, including achamber wall; a support configured to hold a wafer in the chamber; and aliner, configured to surround the support, including: a top sidedetachably hung on the chamber wall, and a bottom side including gaspassages for plasma particles to pass through the liner.
 2. Theapparatus of claim 1 further comprising a pump disposed under thechamber, and an exhaust tube coupled to the pump, the exhaust tube beinga straight tube.
 3. The apparatus of claim 1, wherein the gas passagesinclude a bottom opening at a bottom surface of the bottom side.
 4. Theapparatus of claim 3, wherein the bottom opening has a cylindrical shapeor cone shape.
 5. The apparatus of claim 1, wherein the liner furtherincludes a lateral side extending between the top side and the bottomside, and a corner at a joint of the lateral side and the bottom side.6. The apparatus of claim 5, wherein the gas passages include a corneropening at the corner.
 7. The apparatus of claim 6, wherein the corneropening is configured to form a passage way tilted with respect to abottom surface of the bottom side.
 8. The apparatus of claim 1, whereinthe liner is symmetric with respect to wafer to be disposed in thechamber.
 9. The apparatus of claim 1, wherein the liner is free ofopenings in a lateral portion of the liner.
 10. The apparatus of claim1, wherein the liner is to confine plasma generated in the chamber. 11.A semiconductor manufacturing apparatus including a chamber designed toignite plasma at a first pressure, the apparatus comprising: a radiofrequency (RF) source, configured to generate an RF signal and supplyelectrical power at a first terminal and a second terminal; and a matchnetwork, configured to couple the power from the RF source to thechamber to cause plasma ignition in the chamber at a second pressurelower than the first pressure, the match network comprising: a firstcircuit configured to adjust a voltage level in response to the RFsignal as inputted at the first terminal, the first circuit including afirst inductive device to output an adjusted voltage level, the firstinductive device and a capacitive circuit being connected in parallelbetween the first terminal and a first voltage level; and a secondcircuit including a second inductive device to output a second voltagelevel to the chamber for igniting plasma at the second pressure, thesecond inductive device being directly coupled between the secondterminal and the first voltage level, wherein the second voltage levelis larger than the first voltage level.
 12. The apparatus of claim 11,wherein a maximum current node in reference to a current of the firstterminal at the first inductive device and a maximum voltage node inreference to a voltage of the second terminal at the second inductivedevice are disposed symmetrically with respect to a central line of thechamber.
 13. The apparatus of claim 11, wherein the second voltage levelis higher than the adjusted voltage level.
 14. The apparatus of claim11, wherein the first inductive device or the second inductive deviceincludes an antenna in the form of a planar coil or helical coil. 15.The apparatus of claim 11, wherein the second inductive device ispositioned closer to a central line of the chamber than the firstinductive device.
 16. The apparatus of claim 15, wherein the firstinductive device and the second inductive device are concentricallyaround the central line.
 17. The apparatus of claim 11 furthercomprising a shield configured to enclose the semiconductormanufacturing apparatus and the match network.
 18. The apparatus ofclaim 11, wherein the apparatus is configured to manufacture asemiconductor device, wherein the semiconductor device includes: a firstregion including devices having a first density; and a second region,spaced apart from the first region, including devices having a seconddensity, the second density smaller than the first density, and a seconddepth of the devices in the second region being equal to a first depthof the devices in the first region, wherein an error rate of differencein depth between the devices in the first region and the devices in thesecond region with respect to the second depth ranges from 6% to 8%. 19.The apparatus of claim 18, wherein a first sidewall angle of the devicesin the first region is equal to a second sidewall angle of the devicesin the second region, and an error rate of difference in sidewall anglebetween the devices in the first region and the devices in the secondregion with respect to the first sidewall angle ranges from 4% to 7%.20. The apparatus of claim 19, wherein an error rate of difference insidewall angle between a first sidewall and a second sidewall of thedevices in the first region with respect to the first sidewall angleranges from 4% to 7%.